Electronic modules having grounded electromagnetic shields

ABSTRACT

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to U.S. Utility patent application Ser. No.11/199,319 filed Aug. 8, 2005 and U.S. Utility patent application Ser.No. 11/435,913 filed May 17, 2006, the disclosures of which are herebyincorporated herein by reference in their entireties. This applicationis also related to the following concurrently filed U.S. patentapplication Ser. No. 11/768,014 entitled INTEGRATED SHIELD FOR A NO-LEADSEMICONDUCTOR DEVICE PACKAGE; application Ser. No. 11/952,484 entitledFIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD; application Ser. No.11/952,513 entitled ISOLATED CONFORMAL SHIELDING; application Ser. No.11/952,545 entitled CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP;application Ser. No. 11/952,592 entitled CONFORMAL SHIELDING PROCESSUSING FLUSH STRUCTURES; application Ser. No. 11/952,617 entitled HEATSINK FORMED WITH CONFORMAL SHIELD; application Ser. No. 11/952,634entitled CONFORMAL SHIELDING PROCESS USING PROCESS GASES; applicationSer. No. 11/952,670 entitled BOTTOM SIDE SUPPORT STRUCTURE FOR CONFORMALSHIELDING PROCESS; application Ser. No. 11/952,690 entitled BACKSIDESEAL FOR CONFORMAL SHIELDING PROCESS; application Ser. No. 12/913,364entitled BACKSIDE SEAL FOR CONFORMAL SHIELDING PROCESS (Divisional); andapplication Ser. No. 12/797,381 entitled INTEGRATED POWER AMPLIFIER ANDTRANSCEIVER; all of which are commonly owned and assigned, at the timeof the invention, and are hereby incorporated herein by reference intheir entireties.

FIELD OF THE DISCLOSURE

The present disclosure relates to electronic modules havingelectromagnetic shields and methods of manufacturing the same.

BACKGROUND

Electronic components have become ubiquitous in modern society. Theelectronics industry routinely announces accelerated clocking speeds,higher transmission frequencies, and smaller integrated circuit modules.While the benefits of these devices are myriad, smaller electroniccomponents that operate at higher frequencies also create problems.Higher operating frequencies mean shorter wavelengths, where shorterconductive elements within electronic circuitry may act as antennas tounintentionally broadcast electromagnetic emissions throughout theelectromagnetic spectrum. If the signal strengths of the emissions arehigh enough, the emissions may interfere with the operation of anelectronic component subjected to the emissions. Further, the FederalCommunications Commission (FCC) and other regulatory agencies regulatethese emissions, and as such, these emissions must be kept withinregulatory requirements.

One way to reduce emissions is to form a shield around the modules.Typically, a shield is formed from a grounded conductive structure thatcovers a module or a portion thereof. When emissions from electroniccomponents within the shield strike the interior surface of the shield,the electromagnetic emissions are electrically shorted through thegrounded conductive structure that forms the shield, thereby reducingemissions. Likewise, when external emissions from outside the shieldstrike the exterior surface of the shield, a similar electrical shortoccurs, and the electronic components in the module do not experiencethe emissions.

If the electronic components in these modules are formed on a substrate,the conductive structure that forms the shield needs to be coupled toground through the substrate. However, the miniaturization of themodules makes it increasingly difficult to couple the shields to theground. Furthermore, shielding the inner layers within the substratebecomes more and more important as miniaturization allows a greaterdensity of these modules to be placed within a given area. Thus, what isneeded is a shield structure that is easily coupled to ground and whichprovides more shielding of the inner layers within the substrate.

SUMMARY

The present disclosure may be used to form one or more electronicmodules with electromagnetic shields. In one embodiment, an electronicmodule is formed on a component portion of a substrate. To more easilyattach the electromagnetic shield to ground, a plurality of metalliclayers are provided that extend along a periphery of the componentportion. These metallic layers are coupled to one another and may form aconductive path to ground.

The component portion may define a component area on a surface of thesubstrate. Electronic components are provided on the component area andan overmold may then be provided to cover the component areas. Thesemetallic layers may be exposed through openings formed through at leastthe overmold. An electromagnetic shield may be formed in the opening andover the overmold by applying an electromagnetic shield material. Sincethe exposed metallic layer extends along the periphery of the componentportion, the electromagnetic shield attaches to the exposed metalliclayer and connects to ground. Openings may be formed to any of themetallic layers whether the metallic layers are on the surface of thesubstrate or within the substrate. As a result, inner layers of thesubstrate may be shielded by selecting the metallic layer exposed by theopening.

Those skilled in the art will appreciate the scope of the presentdisclosure and realize additional aspects thereof after reading thefollowing detailed description of the preferred embodiments inassociation with the accompanying drawing figures.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The accompanying drawing figures incorporated in and forming a part ofthis specification illustrate several aspects of this disclosure, andtogether with the description serve to explain the principles of thisdisclosure.

FIG. 1 is a cross sectional view of a first embodiment of an electronicmodule in accordance with this disclosure.

FIGS. 1A-1E illustrates steps for forming the first embodiment of theelectronic module shown in FIG. 1.

FIG. 2 illustrates one embodiment of a metallic layer along a perimeterof the component area of a substrate.

FIG. 3A-3C illustrates steps for forming a second embodiment of anelectronic module in accordance with this disclosure.

FIGS. 4A and 4B illustrates steps for forming a third embodiment of theelectronic module in accordance with this disclosure.

FIG. 5 illustrates one embodiment of a first embodiment of meta-modulehaving a first array of electronic modules.

FIG. 6 is a perspective view of one of the electronic modules from thefirst array of electronic modules in FIG. 5 after the electronic modulehas been singulated from the first embodiment of the meta-module.

FIG. 7A-7L illustrates steps for forming the first embodiment of theelectronic meta-module in FIG. 5.

FIG. 8A-8O illustrates steps for forming a second embodiment of themeta-module having a second array of electronic modules.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the embodiments andillustrate the best mode of practicing the embodiments. Upon reading thefollowing description in light of the accompanying drawing figures,those skilled in the art will understand the concepts of the disclosureand will recognize applications of these concepts not particularlyaddressed herein. It should be understood that these concepts andapplications fall within the scope of the disclosure and theaccompanying claims.

The present disclosure relates to shielded electronic modules andmethods of manufacturing electromagnetic shields in electronic modules.FIG. 1 illustrates one embodiment of an electronic module 10manufactured in accordance with this disclosure. The electronic module10 may be formed on a substrate 12. This substrate 12 may be made fromany material(s) utilized to support electronic components. For example,substrate 12 may be formed from laminates such as FR-1, FR-2, FR-3,FR-4, FR-5, FR-6, CEM-1, CEM-2, CEM-3, CEM-4, CEM-5, and the like.Substrate 12 may also be formed from ceramics and/or alumina.

The substrate 12 has a component portion 14 for the electronic module10. In the illustrated embodiment, the component portion 14 is simplythe portion of the substrate 12 that supports the structures of theelectronic module 10. Thus, the component portion 14 may take up theentire substrate 12 or may take up only a particular portion of thesubstrate 12. The component portion 14 includes a component area 16 on asurface 18 of the substrate 12 and one or more electronic components 20formed on the component area 16. Also, structures (not shown) that formpart of or are coupled to the electronic components 20 may be formedwithin the component portion 14. In addition, the component portion 14may include conductive paths (not shown) that form internal and externalconnections to and from the electronic module 10.

The electronic components 20 may be any type of electronic component.For example, electronic components 20 may be an electronic circuit builton its own semiconductor substrate, such as a processor, volatilememory, non-volatile memory, a radio frequency circuit, or amicro-mechanical system (MEMS) device. Electronic components 20 may alsobe electrical devices such as filters, capacitors, inductors, andresistors or electronic circuits having any combination of theseelectronic devices.

To protect the electronic components 20 from both internal and externalelectromagnetic emissions, an overmold 22 and electromagnetic shield 24are formed over the component area 16 to cover the electronic components20. The overmold 22 may be utilized to isolate the electronic components20 and may be made from insulating or dielectric materials. To couplethe electromagnetic shield 24 to a ground plate 26 below the substrate12, a metallic structure 28 is provided that extends through thecomponent portion 14 and is attached to the electromagnetic shield 24.The metallic structure 28 includes a plurality of metallic layers 30which in this embodiment are stacked over one another. The metalliclayers 30 extend along a periphery 32 of the component portion 14. Theperiphery 32 (or a perimeter) may be any boundary line, area, or volumethat defines a boundary of the component portion 14. Furthermore, themetallic layers 30 may extend along or about the periphery 32 by beingwithin, adjacent to, close to, or by defining the periphery 32 of thecomponent portion 14 itself. As is explained below, in the illustratedexample, the periphery 32 of the component portion 14 is defined by themetallic layers 30 and the metallic layers 30 surround the entireperiphery of the component portion 14. In some embodiments, the metalliclayers 30 extend about only a portion of the periphery 32 and thus maynot define the periphery 32 of the component portion 14. However, asshall be explained in further detail below, the metallic layers 30 inthis embodiment extend along the entire periphery 32 so that eachcircumscribes a cross-section of the component portion 14.

In this embodiment, the electromagnetic shield 24 is attached to themetallic layer 30 on the surface 18 of the substrate 12 that extendsalong a perimeter of the component area 16. The other metallic layers 30are within the substrate 12 and below the metallic layer 30 on thesurface 18 of the substrate 12. However, as shall be explained infurther detail below, the electromagnetic shield 24 may attach to any ofthe plurality of metallic layers 30. Since the metallic layers 30 extendalong the periphery 32 of the component portion 14, the metallic layers30 make it easier to attach the electromagnetic shield 24 to the groundplate 26. The electromagnetic shield 24 may include lateral portions 34and a top portion 36. The lateral portions 34 extend downward to connectto the metallic layers 30. The plurality of metallic layers 30 arecoupled to one another utilizing conductive vertical interconnect accessstructures (“vias”) 38. The conductive vias 38 may be any type ofstructure that connects electronic elements on different vertical levelsof a substrate 12. For example, conductive vias 38 may be formed asplated through-holes, conductive pillars, conductive bars, and the like.

FIGS. 1A-1E illustrates a series of steps for manufacturing theelectronic module 10 illustrated in FIG. 1. It should be noted that theordering of these steps is simply illustrative and the steps may beperformed in a different order. Furthermore, the steps are not meant tobe exhaustive and other steps and different steps may be utilized tomanufacture the electronic module 10, as shall be recognized by those ofordinary skill in the art. The same is true for other steps described inthe Figures of this disclosure. First, the substrate 12 is provided(FIG. 1A). The substrate 12 may be formed from vertically stackedinsulation layers 40 that make up the body of the component portion 14.The vertically stacked insulation layers 40 may be formed from one ormore dielectric or insulating materials. In this embodiment, thecomponent portion 14 has been formed over the ground plate 26. On top ofthe surface 18 of the component portion 14 and between the verticallystacked insulation layers 40 of the component portion 14 are themetallic layers 30 of the metallic structure 28. In this embodiment, themetallic layers 30 extend about the entire periphery 32 of the componentportion 14 to circumscribe a cross-sectional area of the componentportion 14. For example, the top metallic layer 30 on the surface 18 ofthe component portion 14 surrounds a perimeter of the component area 16.Substrate 12 may include additional layers above, below, and betweenvertically stacked insulation layers 40 and metallic layers 30 dependingon the application for the electronic module 10.

Between each of the metallic layers 30, the plurality of conductive vias38 are positioned between the metallic layers 30. The conductive vias 38may be utilized to form a conductive path to the ground plate 26. Inother embodiments, conductive vias 38 may be utilized to form conductivepaths for internal or external connections. For example, a ground nodemay physically be distant from the electronic module 10 and thusconductive vias 38 may be utilized to form a path to an externalconnection that couples the metallic structure 28 to the ground node.

The metallic layers 30 and conductive vias 38 also provide shielding forthe vertically stacked insulation layers 40 within the component portion14 of the substrate 12. As explained above, metallic layers 30 surroundthe periphery 32 of the component portion 14 thereby circumventing across-section of the component portion 14. A set of the plurality ofconductive vias 38 between each of the metallic layers 30 substantiallysurround the perimeter 32 to circumvent the portions of the periphery 32between the metallic layers 30. These conductive vias 38 are discretefrom one another and thus do not fully surround the periphery 32 of thecomponent portion 14. Consequently, gaps between the conductive vias 38are exposed. However, conductive vias 38 may be provided close enough toone another so as to present an electromagnetic barrier toelectromagnetic emissions. The metallic layers 30 may be made from anytype of metal such as, for example, copper (Cu), gold (Au), silver (Ag),Nickel (Ni). The metallic material may also include metallic alloys andother metallic materials mixed with or forming ionic or covalent bondswith other non-metallic materials to provide a desired materialproperty.

Next, electronic components 20 may be provided on the component area 16(FIG. 1B) and the overmold 22 is provided over the surface 18 to coverthe component area 16 (FIG. 1C). In this embodiment, an opening 42 isformed through the overmold 22 to expose a section 44 of the topmetallic layer 30 on the surface 18 of the substrate 12 (FIG. 1D). Aseed layer (not shown) may then be provided over the overmold 22 and thesection 44. Next, an electromagnetic shield material may then be appliedonto the seed layer by, for example, an electrolytic or electrolessplating process so that the electromagnetic shield material builds onthe section 44 within the opening 42 and over the overmold 22. Thisforms the electromagnetic shield 24 over the component area 16 and theelectromagnetic shield 24 is coupled to the section 44 of the metalliclayer 30 on the surface 18 of the substrate 12 (FIG. 1E).

FIG. 2 illustrates a top view of a portion of the top metallic layer 30on the surface 18 of the substrate 12. As explained above, the topmetallic layer 30 may extend along a perimeter 45 of the component area16. The conductive vias 38 (shown in FIG. 1A) may be formed to coupleand/or be integrated with the metallic layers 30. Conductive vias 38 mayhave any shape. FIG. 2 illustrates projections 38A, 38B of twoconductive vias 38 within the substrate 12 beneath the top metalliclayer 30. In this particular embodiment, the conductive vias 38 aresolid metal bars and the projection 38A is of a circular shapedconductive metal bar and projection 38B is of a slot shaped conductivemetal bar. These conductive vias may be made from any type of conductivematerial such as metals like, for example, copper (Cu), gold (Au),silver (Ag), Nickel (Ni). The conductive material may also includemetallic alloys and other conductive materials mixed with or formingionic or non-covalent bonds with other non-conductive materials toprovide a desired material property.

FIGS. 3A and 3B illustrates steps for manufacturing another embodimentof an electronic module. In FIG. 3A, a substrate 46 and an overmold 48are provided utilizing essentially the same steps as described above inFIGS. 1A-1D. However, in this embodiment, an opening 50 along theperiphery 32 of a component portion 52 is not only formed through theovermold 48 but also through the top metallic layer (not shown) thatonce surrounded the component area 51 and the first vertically stackedinsulation layer 54 of the component portion 52. This exposes a section56 of a first metallic layer 58 in a metallic structure 60 which oncewas within the component portion 52 prior to forming the opening 50.

An electromagnetic shield material may then be applied over the overmold48 and the section 56 of the first metallic layer 58 to form anelectromagnetic shield 62 (FIG. 3B). In this embodiment of an electronicmodule 64, the electromagnetic shield 62 is attached to the firstmetallic layer 58 of the metallic structure 60. Consequently, lateralportions 66 of the electromagnetic shield 62 are formed to shield thefirst vertically stacked insulation layer 54 of the component portion52, thus providing shielding to internal portions of the substrate 46.The metallic structure 60 includes a second metallic layer 68 below thefirst metallic layer 58 and a third metallic layer 70. Furthermore, theground plate of this embodiment forms another metallic layer 72 in themetallic structure 60. The opening 50 (illustrated in FIG. 3A) may beformed to expose any of these metallic layers 58, 68, 70, 72. In thismanner, the depth of the lateral portions 66 can be controlled so thatthe electromagnetic shield 62 attaches to any of metallic layers 58, 68,70, 72 that are below the component area 51. This can also be utilizedto determine the degree to which the electromagnetic shield 62 shields aperiphery 74 within the component portion 52. In the electronic module64, the lateral portions 66 of the electromagnetic shield 62 surroundthe first vertically stacked insulation layer 54 to provide shielding.

It should be noted that a grinding process may be utilized to form theopening 50 (shown in FIG. 3A). The grinding process may expose any ofthe metallic layers 58, 68, 70, 72 below the component area 51 but maynot entirely remove the metallic layers 58, 68, 70, 72 above the exposedmetallic layer, which in this example is the first metallic layer 58.Portions of the top metallic layer (not shown) that once was above thefirst metallic layer 58 may remain after grinding. In this case, theelectromagnetic shield 62 may be coupled to both the top metallic layerand the first metallic layer 58.

FIG. 3C illustrates another embodiment of an electronic module 75 formedfrom the same substrate 46 illustrated in FIG. 3A. The electromagneticshield 62 may be coupled to any portion of any of the metallic layers58, 68, 70, 72. In this embodiment, the opening 50 exposes the sidesection of the first metallic layer 58 and the electromagnetic shield 62is coupled to this side section.

Next, FIGS. 4A and 4B illustrate steps for manufacturing yet anotherembodiment of an electronic module. In FIG. 4A, substrate 76 has ametallic structure 78 with first, second, third, and fourth metalliclayers 82, 84, 86, 88 in a component portion 90. As in the previousembodiment, an opening 92 has been formed through an overmold 94, a topmetallic layer (not shown), and a first vertically stacked substratelayer 95 of the component portion 90 to expose a section 96 of the firstmetallic layer 82. Also, the metallic structure 78 includes a pluralityof conductive vias 98 which are provided between each of the metalliclayers 82, 84, 86, 88 to couple the metallic layers 82, 84, 86 to thefourth metallic layer 88 which in this embodiment is a ground plate.However, the plurality of conductive vias 98 between the second andthird metallic layers 84, 86 are not aligned with the plurality ofconductive vias 98 between the first and second metallic layers 82, 84and the third and fourth metallic layers 86, 88.

FIG. 4B illustrates a cross-sectional view of an electronic module 100after a electromagnetic shield 101 is formed over the overmold 102 andthe section 96 (shown in FIG. 4A) of the first metallic layer 82. Theconductive vias 98 along a periphery 104 of the component portion 90between the second and third metallic layers 84, 86 which wereillustrated in FIG. 4A are not illustrated in FIG. 4B because theseconductive vias 98 are not aligned with the conductive vias 98 along theperiphery 104 with the conductive vias 98 between the first and secondmetallic layers 82, 84 and the third and fourth metallic layers 86, 88.

In this embodiment, the second and third metallic layers 84, 86 eachinclude an extended portion 106 that extends from the perimeter 104 andinto the component portion 90. The extended portions 106 on the secondmetallic layer 84 are coupled to the extended portion 106 of the thirdmetallic layer 86 by conductive vias 108. These extended portions 106may be utilized to connect to an electronic component 110 on a componentarea 112. In another embodiment, the opening 92 (shown in FIG. 4A) maybe formed to expose the second metallic layer 84 so that theelectromagnetic shield 101 is attached to the second metallic layer 84which may be coupled to the electronic component 110. Also, in thismanner, metallic layers 82, 84, 86, 88 may form internal connectionsbetween each other or to parts of the electronic module 100 within thecomponent portion 90.

Referring now to FIG. 5, one embodiment of an electronic meta-module 114having a plurality of shielded electronic modules 116 is shown. In thisexample, the plurality of modules 116 is arranged as an array 118 ofmodules 116. The array 118 may be of any shape, however, in thisexample, the array 118 is a rectangular array that arranges theplurality of modules 116 in rows and columns. As shown in FIG. 6, theseshielded electronic modules 116 may be singulated from the electronicmeta-module 114 to provide individual shielded electronic modules 116.

FIGS. 7A-7L illustrates a series of steps for manufacturing theelectronic meta-module 116. To create a substrate for the electronicmeta-module 116, a carrier metallic layer 119 is first provided (FIG.7A) and a first metallic sheet 120 is formed on the carrier metalliclayer 119 (FIG. 7B). Photo lithography may be utilized to form the firstmetallic sheet 120 into a first metallic layer 122 of a plurality ofmetallic structures 124 (FIG. 7C). Photo lithography may also beutilized to form circuitry (not shown) from the first metallic sheet120. This circuitry may form part of the first metallic layers 122, bewithin the first metallic layers 122, couple to the first metalliclayers 122, and/or form structures that are not part of the firstmetallic layers 122. In this embodiment, the first metallic layers 122are separated from one another because the plurality of metallicstructures 124 are to be built as separated structures. Also, each ofthese first metallic layers 122 surrounds an aperture 126 which mayinclude the circuitry discussed above (not shown). In other embodiments,the first metallic layers 122 may be a metallic strip and thus would notdefine the aperture 126.

A first set of conductive vias 128 may then be formed on each of thefirst metallic layers 122 of the plurality of metallic structures 124(FIG. 7D). In this embodiment, the conductive vias 128 are provided inrows of three (3) to form an array of conductive vias 128 around each ofthe first metallic layers 122. A first substrate layer 130 (FIG. 7E) maythen be provided over the first metallic layers 122, the first set ofconductive vias 128, and within the apertures 126 (shown in FIG. 7D).The first substrate layer 130 may be formed from a dielectric materialthat is laminated over the first metallic layers 122 and the conductivevias 128. When the first substrate layer 130 is initially provided overthe first metallic layers 122, the first set of conductive vias 128 mayextend above the first substrate layer 130. Thus, conductive vias 128may be grinded so that the conductive vias 128 are flushed with thefirst substrate layer 130. The first substrate layer 130 forms a part ofthe substrate body 132 of the substrate.

In the illustrated embodiment, the conductive vias 128 are formed on thefirst metallic layers 122 prior to providing the first substrate layer130. In the alternative, the first substrate layer 130 may be providedprior to forming the conductive vias 128. Afterwards, holes may beetched into the first substrate layer 130 and a conductive materialplated into these holes to form the conductive vias 128.

When the first substrate layer 130 is provided, each of the apertures126 (shown in FIG. 7D) enclosed by the first metallic layers 122 arefilled with substrate material and each of the first metallic layers 122surrounds an area 134 that forms part of a component portion of thesubstrate body 132. Thus, in the illustrated embodiment, the firstmetallic layer 122 circumscribes the area 134 of the first substratelayer 130 within the substrate body 132 which may define a section ofthe periphery of the component portion. The carrier metallic layer 119may be removed and the process described in FIGS. 7A-7E may be repeatedto form the desired number of additional substrate layers 136, 138 inthe substrate body 132 of the substrate 133 and additional metalliclayers 140, 142, 144 of the metallic structures 124 for each componentportion 146 (FIG. 7F). The substrate 133 is depicted as having second,third, and fourth metallic layers, 140, 142, 144 formed over of thefirst metallic layer 122. Similarly, the second and third substratelayers 136, 138 are formed over the first substrate layer 130. It shouldbe noted however that the substrate 133 does not necessarily have to beformed from the bottom to the top. The substrate 133 could be providedfrom the top to the bottom where the third substrate layer 138 and thirdand fourth metallic layers 142, 144 are formed first. In addition,substrate 133 may be built from the middle outwards where first metalliclayer 122 and first substrate layer 130 are one of the middle layers ofthe substrate body 132. The second, third, and fourth metallic layers140, 142, 144 and second and third substrate layers 136, 138 would beformed on either side of the first metallic layer 122 and firstsubstrate layer 130 to form the substrate 133.

The substrate 133 may form the plurality of component portions 146 inthe substrate body 132. In this embodiment, each component portion 146includes a component area 148 on a surface 150 of the substrate body132. Next, one or more electronic components 152 may be formed on eachcomponent area 148 (FIG. 7G) and then an overmold 154 provided over thesurface 150 to cover the component areas 148 (FIG. 7H). Channels 156 areformed along a periphery 158 of each of the component portions 146 (FIG.7I).

FIG. 7J illustrates a cross sectional view between two componentportions 146 after the channels 156 have been formed through theovermold 154 and the fourth metallic layers 144 and the third substratelayers 138. These channels 156 extend through the overmold 154 and thesubstrate body 132 in accordance with the desired metallic layer 122,140, 142, 144 to be exposed in the metallic structures 124 of each ofthe component portions 146. In this embodiment, sections 159 of thethird metallic layers 142 are exposed by the channels 156. Anelectromagnetic shield material is applied over the overmold 154 andwithin the channels 156 to form electromagnetic shields 160 over thecomponent areas 148 (FIG. 7K). The sections 159 of the third metalliclayers 142 are coupled to one of the electromagnetic shields 160. Thecomponent portions 146 may be singulated from one another to formindividual shielded electronic modules 116 (FIG. 7L).

FIGS. 8A-8L illustrates a series of steps for manufacturing anotherembodiment of an electronic meta-module. To create a substrate for theelectronic meta-module, a carrier metallic layer 161 is first provided(FIG. 8A) and a first metallic sheet 163 is formed on the carriermetallic layer 161 (FIG. 8B). Photo lithography may be utilized to formthe first metallic sheet 163 into a first metallic layer 162 of aplurality of metallic structures 164 (FIG. 8C). Photo lithography mayalso be utilized to form circuitry (not shown). This circuitry may formpart of the first metallic layers 162, be within the first metalliclayers 162, couple the first metallic layers 162, and/or form structuresoutside of the first metallic layers 162. The first metallic layers 162,illustrated in FIG. 8C, are attached to one another because theplurality of metallic structures 164 are to be built on a meta-metallicstructure 166. Also, each of these first metallic layers 162 surroundsan aperture 168.

A set of conductive vias 170 may then be formed on each of the firstmetallic layers 162 of the plurality of metallic structures 164 in themeta-metallic structure 166 (FIG. 8D). In this embodiment, the set ofconductive vias 170 are provided around each of the first metalliclayers 162. A first substrate layer 172 may then be provided over thefirst metallic layers 162, within the apertures 168, and the set ofconductive vias 170 (FIG. 8E). The first substrate layer 172 may beformed from a dielectric material that is laminated over the firstmetallic layers 162 and the set of conductive vias 170. When the firstsubstrate layer 172 is initially provided over the first metallic layers162 and the set of conductive vias 170, the set of conductive vias 170may extend above the first substrate layer 172. Thus, set of conductivevias 170 may be grinded so that the set of conductive vias 170 are flushwith the first substrate layer 172. The first substrate layer 172 formsa part of the substrate body 171 of the substrate. The set of conductivevias 170 of the illustrated embodiment were formed on the first metalliclayers 162 prior to providing the first substrate layer 172. In thealternative, the first substrate layer 172 may be provided prior toforming the set of conductive vias 170. Afterwards, holes may be etchedinto the first substrate layer 172 and a conductive material plated intothese holes to form the set of conductive vias 170.

When the first substrate layer 172 is provided, each of the apertures168 (shown in FIG. 8D) enclosed by the first metallic layers 162 arefilled with substrate material and each of the first metallic layers 162surrounds an area 174 that is part of a component portion within thesubstrate body 171. Thus, in the illustrated embodiment, the firstmetallic layer 162 circumscribes the area 174 and defines a section ofthe periphery of the component portion. Next, a second metallic sheet176 may be provided over the first substrate layer 172 (FIG. 8F). Thesecond metallic sheet 176 may then be formed into second metallic layers178 of each of the metallic structures 164 in the meta-metallicstructure 166 (FIG. 8G). The second metallic layers 178 in theillustrated embodiment include an extended portion 180. Conductive vias182 may then be provided on the extended portion 180 of the secondmetallic layers 178 and a second substrate layer 184 provided over theconductive vias 182 and second metallic layers 178 (FIG. 8H).

The process described in FIGS. 8A-8H may be repeated to form the desirednumber of substrate layers 172, 184, 186 in the substrate body 171 ofthe substrate 187 and first, second, third, and fourth metallic layers162, 178, 188, 190 in the metallic structures 164 for each componentportion 192 (FIG. 8I). The substrate 187 is depicted as having second,third, and fourth metallic layers 178, 188, 190 formed over of the firstmetallic layer 162. Similarly, the second and third substrate layers178, 186 are formed over the first substrate layer 172. The substrate187 thus may be formed to have the plurality of component portions 192in the substrate body 171. In this embodiment, each component portion192 includes a component area 194 on a surface 196 of the substrate body171. Next, one or more electronic components 198 may be formed on eachcomponent area 194 (FIG. 8J) and then an overmold 200 provided over thesurface 196 to cover the component areas 194 (FIG. 8K). Channels 202 areformed along the periphery 204 of each of the component portions 192(FIG. 8L).

FIG. 8M illustrates a cross sectional view between two componentportions 192 after the channels 202 have been formed through theovermold 200 and the fourth metallic layers 190 and the third substratelayers 186. These channels 202 extends through the overmold 200 and thesubstrate body 171 in accordance with the desired metallic layer 162,178, 188, 190 to be exposed in the metallic structures 164 of each ofthe component portions 192. In this embodiment, sections 204 of thethird metallic layers 188 are exposed by the channels 202. Anelectromagnetic shield material is applied over the overmold 200 andwithin the channels 202 to form electromagnetic shields 206 over thecomponent areas 194 (FIG. 8N). The sections 204 of the third metalliclayers 188 are coupled to one of the electromagnetic shields 206. Thecomponent portions 192 may be singulated from one another to formindividual shielded electronic modules 208 (FIG. 8O).

Those skilled in the art will recognize improvements and modificationsto the preferred embodiments of the present disclosure. All suchimprovements and modifications are considered within the scope of theconcepts disclosed herein and the claims that follow.

1. A method of manufacturing an electronic module, comprising: providing a substrate having a component portion wherein the component portion includes a component area on a surface of the substrate, and a plurality of metallic layers that extend along a periphery of the component portion wherein the plurality of metallic layers are coupled to one another; providing an electronic component on the component area; providing an overmold over the surface to cover the component area; forming an opening through at least the overmold that exposes at least a section of one of the plurality of metallic layers along the periphery of the component portion; and applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area that is coupled to at least the section of the one of the plurality of metallic layers.
 2. The method of claim 1 wherein providing a substrate further comprises providing the plurality of metallic layers stacked over one another.
 3. The method of claim 2, wherein providing the substrate further comprises providing one or more conductive vertical interconnect access structure (vias) that couple the plurality of metallic layers.
 4. The method of claim 1, further comprising providing a ground plate coupled to the plurality of metallic layers.
 5. The method of claim 1, wherein providing a substrate further comprises providing the plurality of metallic layers so that the plurality of metallic layers substantially surround the periphery of the component portion.
 6. The method of claim 1, wherein the plurality of metallic layers comprises a first metallic layer and a second metallic layer below the first metallic layer when the substrate is provided.
 7. The method of claim 6, wherein forming the opening comprises removing a portion of the overmold directly above at least a section of the first metallic layer along the periphery of the component portion wherein the section of the one of the plurality of metallic layers along the periphery of the component portion is the section of the first metallic layer.
 8. The method of claim 6, wherein forming the opening comprises removing a portion of the overmold, at least a portion of the first metallic layer, and a portion of the substrate directly above a section of the second metallic layer wherein the section of the one of the plurality of metallic layers along the periphery of the component portion is the section of the second metallic layer.
 9. The method of claim 1, wherein, when the substrate is provided: the plurality of metallic layers have a first metallic layer and a second metallic layer within the substrate, wherein the second metallic layer is positioned below the first metallic layer, each of the first and second metallic layers having an extended section that extends from the periphery and into the component portion; and at least one conductive vias that couples each of the extended sections of the first and second metallic layers.
 10. An electronic module, comprising: a substrate comprising a component portion wherein the component portion includes a component area on a surface of the substrate, and a plurality of metallic layers extending along a periphery of the component portion and the plurality of metallic layers being coupled to one another; an electronic component on the component area; an overmold formed over the component area; and an electromagnetic shield formed over the overmold and covering the component area, the electromagnetic shield being coupled along the periphery of the component portion to at least a first metallic layer in the plurality of metallic layers.
 11. The electronic module of claim 10, further comprising a plurality of conductive vias that couple the plurality of metallic layers.
 12. The electronic module of claim 10, wherein the plurality of metallic layers further comprises: wherein the first metallic layer is on the surface of the substrate and extends along a perimeter of the component area; and a second metallic layer within the substrate that is positioned below the first metallic layer.
 13. The electronic module of claim 12, further comprising: wherein the first metallic layer substantially surrounds the perimeter of the component area, and the second metallic layer substantially surrounds the periphery of the component portion; and a first plurality of conductive vias positioned between the first and second metallic layers and substantially surrounding the periphery of the component portion.
 14. The electronic module of claim 13, further comprising: the plurality of metallic layers further comprising a third metallic layer that extends along the periphery of the component portion and is below the first and second metallic layers; and a second plurality of conductive vias positioned between the second and third metallic layers and substantially surrounding the periphery of the component portion.
 15. The electronic module of claim 10, wherein the plurality of metallic layers further comprise: wherein the first metallic layer is below the component area; and a second metallic layer within the substrate that is positioned below the first metallic layer.
 16. The electronic module of claim 15, further comprising: wherein the first metallic layer substantially surrounds the periphery of the component portion; wherein the second metallic layer substantially surrounds the periphery of the component portion; and a first plurality of conductive vias positioned between the first and second metallic layer and substantially surrounding the periphery of the component portion.
 17. The electronic module of claim 10, further comprising: the plurality of metallic layers including a second metallic layer within the substrate wherein the second metallic layer is positioned below the first metallic layer and each of the first and second metallic layers have an extended section that extends from the periphery and into the component portion; and at least one conductive vias that couples each of the extended sections of the first and second metallic layers.
 18. A method of manufacturing a plurality of electronic modules, comprising: providing a substrate comprising a substrate body having a plurality of component portions wherein each of the plurality of component portions includes a component area on a surface of the substrate body and a periphery, and a plurality of metallic structures associated with each of the plurality of component portions, wherein each of the plurality of metallic structures has a plurality of metallic layers that extend along the periphery of one of the plurality of component portions; providing electronic components on the component areas; providing an overmold over the surface of the substrate body to cover the component areas; forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of a first metallic layer in the plurality of metallic layers of each of the plurality of metallic structures; and applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over the component areas wherein the first section of the first metallic layer in each of the plurality of metallic structures are coupled to one of the electromagnetic shields.
 19. The method of claim 18, further comprising singulating the plurality of component portions from the substrate body.
 20. The method of claim 18, wherein providing the substrate comprises forming the plurality of component portions so that the plurality of component portions is configured as an array of component portions.
 21. The method of claim 20, wherein the array of component portions includes columns and rows of component portions.
 22. The method of claim 18, wherein providing the substrate comprises: providing a first metal sheet; for each of the plurality of metallic structures, forming the first metallic layer from the first metal sheet; and providing a first substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures.
 23. The method of claim 22, wherein providing the substrate further comprises, for each of the plurality of metallic structures, providing one or more conductive vias on the first metallic layer.
 24. The method of claim 23, wherein: for each of the plurality of metallic structures, the first metallic layer substantially surrounds an area of the first substrate layer that forms a part of the one of the plurality of component portions; and wherein, for each of the plurality of metallic structures, the one or more conductive vias on the first metallic layer comprises a plurality of conductive vias substantially surrounding the area of the first substrate layer that forms the part of the one of the plurality of component portions.
 25. The method of claim 24, wherein providing the substrate further comprises: providing a second metal sheet over or below the first substrate layer; for each of the plurality of metallic structures, forming a second metallic layer of the plurality of metallic layers from the second metal sheet; and providing a second substrate layer of the substrate body on the second metallic layer of each of the plurality of metallic structures.
 26. The method of claim 25, wherein providing the substrate further comprises, for each of the plurality of metallic structures, providing one or more conductive vias on the second metallic layer of each of the plurality of metallic structures.
 27. The method of claim 18, wherein providing the substrate further comprises, for each of the plurality of metallic structures, one of the plurality of metallic layers substantially surrounds a perimeter of the component area in the one of the plurality of component portions.
 28. The method of claim 18, wherein the plurality of metallic structures are separated from one another, when the substrate is provided.
 29. The method of claim 18, wherein providing the substrate further comprises providing a meta-metallic structure having the plurality of metallic structures.
 30. The method of claim 18, wherein providing the substrate further comprises: providing a first metal sheet; for each of the plurality of metallic structures, forming the first metallic layer of the plurality of metallic layers having a first extended section that extends from the periphery and into the one of the plurality of component portions; for each of the plurality of metallic structures, forming one or more conductive vias on each of the first extended sections; providing a first substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures; providing a second metal sheet over or below the first substrate layer; for each of the plurality of metallic structures, forming a second metallic layer of the plurality of metallic layers from the second metal sheet having a second extended section that extends from the periphery and into the one of the plurality of component portions and are coupled to the one or more conductive vias on each of the first extended sections; and providing a second substrate layer of the substrate body over the second metallic layer of each of the plurality of metallic structures. 